High definition Copper Base Board - Ceramic PCB single and double sided ceramics PCB manufacture Ceramic Substrates| YMS PCB – Yongmingsheng
Ceramic PCB: ceramic substrate circuit board
Ceramic PCB is a kind of heat conducting ceramic powder and organic binder, and the heat conduction organic ceramic PCB is prepared at a thermal conductivity of 9-20W/m. In other words, ceramic PCB is a printed circuit board with ceramic base material, which is highly thermally conductive materials such as alumina, aluminum nitride, as well as beryllium oxide, which can make a quick effect on transferring heat away from hot spots and dissipating it over the whole surface. What’s more, ceramic PCB is fabricated with LAM technology, which is a laser rapid activation metallization technology. So ceramic PCB is highly versatile that can take place of the entire traditional printed circuit board with a less complicated construction with enhanced performance.
Apart from MCPCB, if you want to use PCB in high pressure, high insulation, high frequency, high temperature, and high reliable and minor volume electronic products, then Ceramic PCB will be your best choice.
Why Ceramic PCB has such excellent performance? You can have a brief view on its basic structure and then you will understand.
- 96% or 98% Alumina (Al2O3), Aluminum Nitride (ALN), or Beryllium Oxide (BeO)
- Conductors material: For thin, thick film technology, it’ll be silver palladium (AgPd), gold pllladium (AuPd); For DCB (Direct Copper Bonded) it’ll be copper only
- Application temp: -55~850C
- Thermal conductivity value: 24W~28W/m-K (Al2O3); 150W~240W/m-K for ALN , 220~250W/m-K for BeO;
- Max compression strength: >7,000 N/cm2
- Breakdown Voltage (KV/mm): 15/20/28 for 0.25mm/0.63mm/1.0mm respectively
- Thermal expansion conefficient(ppm/K): 7.4 (under 50~200C)
Types of ceramic PCBs
1. High temperature ceramic PCB
2. Low temperature ceramic PCB
3.Thick film ceramic PCB
YMS Ceramic PCB manufacturing capabilities:
| YMS Ceramic PCB manufacturing capabilities overview | ||
| Feature | capabilities | |
| Layer Count | 1-2L | |
| Material and Thickness | Al203: 0.15, 0.38,0.5,0.635,1.0,1.5,2.0mm etc. | |
| SIN: 0.25,0.38,0.5,1.0mm etc. | ||
| AIN: 0.15, 0.25,0.38,0.5,1.0mm etc. | ||
| Thermal conductivity | Al203: Min. 24 W/m.k up to 30W/m.k | |
| SIN: Min. 85 W/m.k up to 100W/m.k | ||
| AIN: Min. 150 W/m.k up to 320 W/m.k | ||
| Al2O3 | Al2O3 has better light reflectivity – making it suited for LED products. | |
| SIN | SiN has a very low CTE. Coupled with a high Rupture Strength it can withstand stronger thermal shock. | |
| AlN | AlN has superior Thermal Conductivity – making it suitable for very high power applications requiring the best possible thermal substrate. | |
| Board Thickness | 0.25mm-3.0mm | |
| copper Thickness | 0.5-10OZ | |
| Minimum line Width and Space | 0.075mm/0.075mm(3mil/3mil) | |
| Speciality | Countersink,Counterbore drilling.etc. | |
| Min mechanical Drilled Size | 0.15mm(6mil) | |
| Conductors material: | For thin, thick film technology, it’ll be silver palladium (AgPd), gold pllladium (AuPd)，Platinum For DCB (Direct Copper Bonded) it’ll be copper only | |
| Surface Finish | HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc. | |
| Solder Mask | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc. | |
| polished | Ra < 0.1 um | |
| lapped | Ra < 0.4 um | |
High definition Copper Base Board - Ceramic PCB single and double sided ceramics PCB manufacture Ceramic Substrates| YMS PCB – Yongmingsheng Related Video: