PCB aluminum substrate has many names, including aluminum clad, aluminum PCB, metal coated printed circuit board, heat conduction PCB, etc.The advantage of printed circuit board is that its heat dissipation is significantly better than the standard FR-4 structure, the medium used is usually 5-10 times the thermal conductivity of ordinary epoxy glass.And the heat transfer index of one-tenth thickness is more efficient than traditional hard printed circuit board.The following aluminum substrate pcb manufacturer Yongmingsheng will take you to understand the types of aluminum substrate pcb.
Flexible dielectric is one of the latest developments in IMS materials.This material has excellent insulation, flexibility and thermal conductivity.In the use of flexible aluminum materials such as 5754, can form a variety of shapes and angles of products.This eliminates expensive fixtures, cables, and connectors.Although the material is flexible, the aim is to bend it into place and hold it in place.
The “sub-components” of the non-thermal material are treated independently in the “hybrid” IMS structure and then bonded to the aluminium base with the hot material.The most commonly used structures are two – or four-storey sub-assemblies made from conventional FR-4 materials.It is bonded on the aluminum base with thermoelectric medium, which helps to dissipate heat, increase rigidity and play a shielding role.Other benefits include:
1.Lower cost than the construction of all thermal conductive materials.
2.Provides better thermal performance than standard FR-4 products.
3.can eliminate the expensive radiator and associated assembly steps.
4.Can be used in RF applications where the RF loss characteristics of the PTFE surface layer are required.
5.The use of component Windows in aluminum to accommodate through-hole assemblies allows connectors and cables to move connectors through the substrate while welding fillet corners to create a seal without the need for special gaskets or other expensive adapters.
In one of the most complex structures, a single layer of aluminum forms the core of a multi-layer thermal structure.After plating and filling the medium, the aluminum sheet is stratified.Hot melt material or secondary components can be laminated to both sides of the aluminum plate with hot melt material.When finished, it will form a layered structure similar to that of a traditional multilayer aluminum substrate.Electroplated through holes are inserted into the aluminum gaps to maintain electrical insulation.In the other, the copper core allows for direct electrical connection and an insulated through hole.
In the high performance power supply market, multi-layer IMSPCB is made of multi-layer heat conduction medium.These structures have one or more layers of circuits embedded in the dielectric, with blind holes used as heat channels or signal channels.While single-layer designs are more expensive and less efficient for heat transfer, they provide a simple and effective cooling solution for more complex designs.
The above is the type of aluminum substrate, I hope to have a certain help to you.We are a aluminum substrate pcb supplier from China, welcome to consult us!