Original Factory Layer Rigid-Flex Circuit Prototype - 1 Layer Thermoelectric Copper base Board | YMSPCB – Yongmingsheng

Copper base Board production process

1. Provide the copper plate have pretreated
2. UV ink is printed on the bending part of copper plate
3. The surface of copper plate is browned by using browning liquid
4. Press and drill copper plate covered with UV ink
5. Electroplate the first finished product
6. Make outer layer on copper plate
7. Solder mask printing on copper substrate
8. V – CUT the second finished product
9. The bending position of copper plate is surface treated and the finished product is obtained
10. Check up case ,packing and shipping