Metal clad pcb 1 Layer Thermoelectric Copper base Board| YMSPCB

Product Detail

Copper base Board production process

Provide the copper plate have pretreated
UV ink is printed on the bending part of copper plate
The surface of copper plate is browned by using browning liquid
Press and drill copper plate covered with UV ink
Electroplate the first finished product
Make outer layer on copper plate
Solder mask printing on copper substrate
V – CUT the second finished product
The bending position of copper plate is surface treated and the finished product is obtained
Check up case ,packing and shipping

YMS copper based PCB manufacturing capabilities overview
Feature	capabilities
Layer Count	1-4L
Thermal Conductivity(w/m.k)	Aluminum PCB:0.8-10
	Copper PCB:2.0-398
Board Thickness	0.4mm-5.0mm
copper Thickness	0.5-10OZ
Minimum line Width and Space	0.1mm/0.1mm(4mil/4mil)
Speciality	Countersink,Counterbore drilling.etc.
Types of Aluminum Substrates	1000 series;5000 series;6000 series,3000 series.etc.
Min mechanical Drilled Size	0.2mm(8mil)
Surface Finish	HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc.
Solder Mask	Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.