With over 10 years as an industry leader, YMS is one of the most experienced PCB and PCB assembly manufacturer in China.
We are proud to manufacture high-quality PCBs and provide the best PCB assembly services for our customers.
Our goal is to be categorized as the easiest Printed Circuit Board manufacturer to do business with.
Technical index | Mass Batch | Small batch | Sample | ||
Base Material | FR4 | Normal Tg | Shengyi S1141、KB6160、Huazhen H140(not suitable for lead free process ) | ||
Middle Tg | For HDI、multi layers: SY S1000H、ITEQIT158、HuazhengH150; TU-662; | ||||
High Tg | For thick copper、high layer:SY S1000-2; ITEQIT180A; HuazhengH170;ISOLA:FR408R; 370HR; TU-752; | ||||
Halogen Free | Middle Tg :SY S1150G、HuazhengH150HF、H160HF;high Tg: SY S1165 | ||||
High CTI | CTI≥600 SY S1600、Huazheng H1600HF、H1600A; | ||||
High Frequency | Rogers、 Arlon、Taconic、SY SCGA-500、S7136; HuazhengH5000 | ||||
High Speed | SY S7439;TU-862HF、TU-872SLK;ISOLA:I-Speed、I-Tera@MT40;Huazheng:H175、H180、H380 | ||||
Flex Material | Base | Glue-free:Dupont AK XingyangW-type, Panosonic RF-775; | |||
Coverlay | SY SF305C、Xingyang Q-type | ||||
Special PP | No flow PP:VT-447LF,Taiguang 370BL Arlon 49N | ||||
Ceramic filled adhesive sheet:Rogers4450F | |||||
PTFE adhesive sheet:Arlon6700、Taconic FR-27/FR-28 | |||||
Double-sided coatingPI:xingyang N-1010TF-mb | |||||
Metal Base | Berguist Al-base 、Huazheng Al-base、chaosun Al-base、copperbase | ||||
Special | High heat resistance rigidity PI: Tenghui VT-901、Arlon 85N,SY S260(Tg250) | ||||
High thermal conductivity material:92ML | |||||
Pure ceramic material:alumina ceramic、Aluminum nitride ceramics | |||||
BT material:Taiwan Nanya NGP-200WT | |||||
Layers | FR4 | 36 | 60 | 140 | |
Rigid&Flex /(Flex) | 16(6) | 16(6) | 24(6) | ||
High Frequency Mixed Lamination | 12 | 12 | 20 | ||
100% PTFE | 6 | 6 | 10 | ||
HDI | 2 steps | 3 steps | 4 steps |
Technical Index | Mass Batch | Small Batch | Sample | ||
Delivery Size | Max(mm) | 460*560 | 460*560 | 550*900 | |
(mm) | Min(mm) | 20*20 | 10*10 | 5*10 | |
Width / Gap | Inner(mil) | 0.5OZ base copper: 3/3 1.0OZ base copper: 4/4 2.0OZ base copper: 5/6 | |||
3.0OZ base copper: 7/9 4.0OZ base copper: 8/12 5.0OZ base copper: 10/15 | |||||
6.0OZ base copper: 12/18 10 OZ base copper: 18/24 12 OZ base copper: 20/28 | |||||
Outer(mil) | 1/3OZ base copper: 3/3 0.5OZ base copper: 4/4 1.0OZ base copper: 5/5 | ||||
2.0OZ base copper: 6/8 3.0OZ base copper: 7/10 4.0OZ base copper: 8/13 | |||||
5.0OZ base copper: 10/16 6.0OZ base copper: 12/18 10 OZ base copper: 18/24 | |||||
12 OZ base copper: 20/28 15 OZ base copper: 24/32 | |||||
Line Width Tolerance | >5.0 mil | ±20% | ±20% | ±1.0mil | |
≤5.0 mil | ±1.0mil | ±1.0mil | ±1.0mil | ||
Drilling | Min laser (mm) | 0.1 | 0.1 | 0.1 | |
Min CNC(mm) | 0.2 | 0.15 | 0.15 | ||
Max CNC drill bit(mm) | 6.5 | 6.5 | 6.5 | ||
Min Half Hole(mm) | 0.5 | 0.4 | 0.4 | ||
PTH Hole (mm) | Normal | ±0.1 | ±0.075 | ±0.075 | |
Pressing Hole | ±0.05 | ±0.05 | ±0.05 | ||
Hole Angle (conical) | Width of upper diameter≤6.5mm:800、900、1000、1100;Width of upper diameter≥6.5mm:900; | ||||
Precision of Depth-control Drilling(mm) | ±0.10 | ±0.075 | ±0.05 | ||
Number of blind CNC holes of one side | ≤2 | ≤3 | ≤4 | ||
Minimum via hole spacing (different network, military, medical, automobile )mm | 0.5 | 0.45 | 0.4 | ||
Minimum via hole spacing (different network, general industrial control and consumer electronic ) mm | 0.4 | 0.35 | 0.3 |
Technical index | Mass batch | Small batch | sample | ||
Drilling | The minimum hole wall spacing of the over hole (the same network mm) | 0.2 | 0.2 | 0.15 | |
Minimum hole wall spacing (mm) for device holes | 0.8 | 0.7 | 0.7 | ||
The minimum distance from via hole to the inner copper or line | 0.2 | 0.18 | ≤10L: 0.15 | ||
>10L: 0.18 | |||||
The min distance from Device hole to inner copper or line | 0.3 | 0.27 | 0.25 | ||
Welding Ring | Via hole | 4(HDI 3mil) | 3.5(HDI 3mil) | 3 | |
(mil) | Component hole | 8 | 6 | 6 | |
Solder Dam (mil) | (solder mask) | 5 | 4 | 4 | |
(hybrid) | 6 | 5 | 5 | ||
Final Board Thickness | >1.0 mm | ±10% | ±8% | ±8% | |
≤1.0 mm | ±0.1mm | ±0.1mm | ±0.1mm | ||
Board thickness(mm) | 0.5-5.0 | 0.4-6.5 | 0.3-11.5 | ||
Board thickness/drill bit | 10:01:00 | 12:01:00 | 13:01:00 | ||
Via hole(drill bit)plug hole(plug solder ) | 0.25-0.5mm | 0.20-0.5mm | 0.15-0.6mm | ||
Blind buried hole, hole inside pad | 0.25-0.5mm | 0.20-0.5mm | 0.10-0.6mm | ||
Bow and twist | ≤0.75% | ≤0.75% | ≤0.5% | ||
Impedance Control | ≥5.0mil | ±10% | ±10% | ±8% | |
<5.0mil | ±10% | ±10% | ±10% | ||
CNC | contour tolerance(mm) | ±0.15 | ±0.10 | ±0.10 | |
V-CUT Tolerance of residual thickness(mm) | ±0.15 | ±0.10 | ±0.10 | ||
Routing slot(mm) | ±0.15 | ±0.10 | ±0.10 | ||
Precision of controlled deep milling(mm) | ±0.15 | ±0.10 | ±0.10 |
Technical index | Mass batch | Small batch | sample | ||
Contour | Bevel edge | 20~60 degree;±5degree | |||
Surface Treatments | Immersion gold | Ni thickness(micro inch) | 118-236 | 118-236 | 118-236 |
Max gold (uinch) | 3 | 3 | 6 | ||
Hard gold(Au thick) | Gold finger(uinch) | 15 | 30 | 60 | |
NiPdAu | NI(uinch) | 118-236 | |||
PA(uinch) | 2-5 | ||||
Au(uinch) | 1-5 | ||||
Graph electric gold | NI(uinch) | 120-400 | |||
AU(uinch) | 1-3 | ||||
Immersion tin | Tin(um) | 0.8-1.2 | |||
Immersion Ag | Ag(uinch) | 6-10 | |||
OSP | thick(um) | 0.2-0.5 | |||
HAL/HAL LF | BGApad(mm) | ≥0.3×0.3 | |||
thickness(mm) | 0.6≤H≤3.0 | ||||
Board thickness vs hole diameter | Press hole≤3:1 | ||||
Tin(um) | 2.0-40.0 | ||||
Rigid & Flex | Maximum dielectric thickness of flex | Glue –free 25um | Glue-free 75um | Glue-free75um | |
Flex part width(mm) | ≥10 | ≥5 | ≥5 | ||
Max delivery size (mm) | 200×400 | 200×500 | 400 ×550 | ||
distance of via hole to edge of Rigid&flex(mm) | ≥1.2 | ≥1.0 | ≥0.8 | ||
(mm)distance of components hole to the edge of R&F | ≥1.5 | ≥1.2 | ≥1.0 | ||
Technical index | Mass batch | Small batch | sample | ||
Rigid & Flex | Structure | The outer layer structure of the flex part, the PI reinforcement structure and the separation structure | Aluminum based rigid flex , rigid flex HDI, combination, electromagnetic shielding film | ||
Special Tech | Back drilling PCB, metal sandwich, thick copper buried blind hole, step slot, disc hole, half hole, mixed lamination | Buried magnetic core PCB | Buried capacitor / resistor, embedded copper in partial area, 100% ceramic PCB, buried riveting nut PCB, embedded components PCB |
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