YMS Heavy copper PCB manufacturing capabilities overview | ||
Feature | capabilities | |
Layer Count | 1-30L | |
Base Material | FR-4 Standard Tg, FR4-mid Tg,FR4-High Tg | |
Thickness | 0.6 mm – 8.0mm | |
Maximum Outer Layer Copper Weight (Finished) | 15OZ | |
Maximum Inner Layer Copper Weight (Finished) | 30OZ | |
Minimum line Width and Space | 4oz Cu 8mil/8mil; 5oz Cu 10mil/10mil; 6oz Cu 12mil/12mil; 12oz Cu 18mil/28mil; 15oz Cu 30mil/38mil .etc. | |
BGA PITCH | 0.8mm(32mil) | |
Min mechanical Drilled Size | 0.25mm(10mil) | |
Aspect Ratio for through hole | 16:1 | |
Surface Finish | HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc. | |
Via Fill Option | The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO) | |
Copper filled, silver filled | ||
Registration | ±4mil | |
Solder Mask | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc. |
1、What are the precautions for heavy copper PCB wiring
2、What are the specifications of heavy copper PCB
3、What are the heavy copper PCB materials