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What is Multi Layers MCPCB?

A Metal Core Printed Circuit Board (MCPCB), also known as a thermal PCB or metal backed PCB, is a type of PCB that has a metal material as its base for the heat spreader portion of the board. The thick metal (almost always aluminum or copper) is covering 1 side of the PCB. Metal core can be in reference to the metal, being either in the middle somewhere or on the back of the board. The purpose of the core of an MCPCB is to redirect heat away from critical board components and to less crucial areas such as the metal heatsink backing or metallic core. Base metals in the MCPCB are used as an alternative to FR4 or CEM3 boards.

A metal core printed circuit board (MCPCB) also known as thermal PCB, incorporates a metal material as its base as opposed to the traditional FR4, for the heat spreader fragment of the board. Heat builds up due to some electronic components during the operation of the board. The purpose of the metal is to divert this heat away from critical board components and towards less crucial areas such as the metal heatsink backing or metallic core. Hence, these PCBs are apt for thermal management.

In a multilayer MCPCB, the layers will be evenly distributed on each side of the metal core. For instance, in a 12-layer board, the metal core will be at the center with 6 layers on the top and 6 layers at the bottom.

MCPCBs are also referred to as insulated metallic substrate (IMS), insulated metal PCBs (IMPCB), thermal clad PCBs, and metal-clad PCBs. In this article, we will be using the acronym MCPCB to avoid ambiguity.

The MCPCBs are made up of thermal insulating layers, metal plates, and metal copper foil. Further design guidelines/recommendations for Metal Core (Aluminum and Copper) Printed Circuit Boards are available upon request; contact YMSPCB at kell@ymspcb.com.or your Sales Representative to inquire more.

metal core pcb

 YMS Multi Layers Metal core PCB manufacturing capabilities:

YMS Multi Layers Metal core PCB manufacturing capabilities overview
Feature capabilities
Layer Count 1-8L
Base Material Aluminum/Copper/Iron Alloy
Thickness 0.8 mm min
Coin material Thickness 0.8-3.0mm
Minimum line Width and Space 0.05mm/0.05mm(2mil/2mil)
BGA  PITCH 0.35mm
Min Copper coin’s clearance 1.0mm min
Min mechanical Drilled Size 0.15mm(6mil)
Aspect Ratio for through hole 16:1
Surface Finish HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc.
Via Fill Option The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO)
Copper filled, silver filled
Registration ±4mil
Solder Mask Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.

 The main reasons for using copper base boards

1. Good heat dissipation:

At present, many 2 layer board and multilayer boards have the advantage of high density and high power, but the heat emission is difficult to be. Normal PCB base material such as FR4, CEM3 is a poor conductor of heat, insulation is between layers, and heat emission cannot go out. Local heating of electronic equipment cannot be eliminated will result in high-temperature failure of electronic components. But the good heat dissipation performance of metal core PCB can solve this heat dissipation problem.

2. Dimensional stability:

Metal core PCB is obviously much more stable in size than printed boards of insulating materials. Aluminum base board and aluminum sandwich board is heating from 30℃ to 140~150℃, its size changes of 2.5~3.0%.

3. Other cause:

Copper base board has shielding effect and replaces brittle ceramic substrate, so it can rest assured to use surface mounting technology to reduce the real effective area of PCB. Copper base board replaces the radiator and other components, improve the heat resistance and physical performance of products and it reduces production costs and labor costs.

You May Like:

1、Application characteristics of aluminum PCB

2、Copper plating process of PCB outer layer (PTH)

3、Copper clad plate and aluminum substrate four major differences

 

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