ITEM |
Parameters |
Base Materials |
Polyimide or Polyester |
Cover-lay |
Polyimide, ,Polyester or Solder Mask |
Thickness |
0.5mil, 1mil, 2mil |
Line Width/Space |
Normal Min. 0.075/0.075mm, Special Min. 0.040/0.040mm |
Conductor |
1/3oz(12§),0.5oz(18§), 1oz(35§), ED or RA Copper |
Min. through hole diameter |
Bit Drill Via Normal Min. ¥O 0.200mm, Special |
Finish Plating |
Electroless Nickel, Immersion Gold, Direct Gold, Soft Gold, Hard Gold, Organic Solderability Preservative, Immersion Tin |
Stiffener |
Stiffener PI, G/Epoxy, CEM3 |
Double Coated tape |
Double Coated tape 3M 467,966, Sony D3430, T4100 ect |