No matter new shopper or old customer, We believe in very long expression and dependable relationship for Factory Outlets China Hw-Ms01 Microwave Motion Sensor Module Single Board 24V ~ 60VDC Microwave Sensor Board Detection Module, To acquire a consistent, profitable, and constant growth by getting a competitive advantage, and by continuously increasing the value added to our shareholders and our employee.
No matter new shopper or old customer, We believe in very long expression and dependable relationship for China Microwave Sensor, Motion Sensor, Till now, the goods list has been updated regularly and attracted clients from around the globe. Detailed facts is often obtained in our web-site and you’ll be served with premium quality consultant service by our after-sale group. They are going to help you get comprehensive acknowledge about our products and make a satisfied negotiation. Company go to to our factory in Brazil is also welcome at any time. Hope to obtain your inquiries for any pleased co-operation.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
YMS Normal PCB manufacturing capabilities overview | ||
Feature | capabilities | |
Layer Count | 1-60L | |
Available Normal PCB Technology | Through hole with Aspect Ratio 16:1 | |
buried and blind via | ||
Hybrid | High Frequency Material such as RO4350B and FR4 Mix etc. | |
High Speed Material such as M7NE and FR4 Mix etc. | ||
Material | CEM- | CEM-1;CEM-2;CEM-4;CEM-5.etc |
FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF,NP170G etc. | |
High Speed | Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933 etc. | |
High Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 etc. | |
Others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000,PEEK,PTFE,ceramic-based etc. | |
Thickness | 0.3mm-8mm | |
Max.copper Thickness | 10OZ | |
Minimum line Width and Space | 0.05mm/0.05mm(2mil/2mil) | |
BGA PITCH | 0.35mm | |
Min mechanical Drilled Size | 0.15mm(6mil) | |
Aspect Ratio for through hole | 16:1 | |
Surface Finish | HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc. | |
Via Fill Option | The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO) | |
Copper filled, silver filled | ||
Registration | ±4mil | |
Solder Mask | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc. |