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Characteristics of FPC
1. Free bending, folding and winding, free movement and expansion in 3D space.
2. Good heat dissipation performance, using FPC to reduce the volume.
3. Realize lightweight miniaturization and thinness, so as to achieve the integration of component device and wire connection.
1、FPC embossing material and surface treatment technology
2、Analysis on the cause of overflow of FPC flexible circuit board pressing