High Quality Fpc - Factory Price China OEM Fr-4 Multilayer PCB Assembly for Electric Home Appliance, PCBA Manufacturing – Yongmingsheng
We attempt for excellence, support the customers”, hopes to become the top cooperation team and dominator enterprise for staff, suppliers and shoppers, realizes worth share and continual marketing for Factory Price China OEM Fr-4 Multilayer PCB Assembly for Electric Home Appliance, PCBA Manufacturing, With a wide range, high quality, fair charges and stylish designs, our items are extensively used on this industries and other industries.
We attempt for excellence, support the customers”, hopes to become the top cooperation team and dominator enterprise for staff, suppliers and shoppers, realizes worth share and continual marketing for China Electric Home Appliance, Pcba, We’ve been sincerely looking forward to cooperate with customers all over the world. We believe we can satisfy you with our high-quality merchandise and perfect service . We also warmly welcome customers to visit our company and purchase our solutions.
What is Multilayer PCBs
Multilayer Printed Circuit Board, It is a type of PCB which comes with a combination of single sided PCB and double sided PCB. It features layers more than double sided PCB.
PCB with special requirements from industries
PCB Sideplating
Sideplating is the metalization of the board edge in the PCB filed. Edge plating, Border plated, plated contour, side metal, these words can also be used to describe the same function.
Half-cut Castellated Holes
Castellations are plated through holes or vias located in the edges of a printed circuit board. are indentations created in the form of semi-plated holes on the edges of the PCB boards.These half holes serve as pads intended to create a link between the module board and the board that it will be soldered onto.
YMS Multilayer PCB manufacturing capabilities:
| YMS Multilayer PCB manufacturing capabilities overview | ||
| Feature | capabilities | |
| Layer Count | 3-60L | |
| Available Multilayer PCB Technology | Through hole with Aspect Ratio 16:1 | |
| buried and blind via | ||
| Hybrid | High Frequency Material such as RO4350B and FR4 Mix etc. | |
| High Speed Material such as M7NE and FR4 Mix etc. | ||
| Thickness | 0.3mm-8mm | |
| Minimum line Width and Space | 0.05mm/0.05mm(2mil/2mil) | |
| BGA PITCH | 0.35mm | |
| Min mechanical Drilled Size | 0.15mm(6mil) | |
| Aspect Ratio for through hole | 16:1 | |
| Surface Finish | HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc. | |
| Via Fill Option | The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO) | |
| Copper filled, silver filled | ||
| Registration | ±4mil | |
| Solder Mask | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc. | |
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