Hot Selling for Hcpv Solar Thermal Ceramic Substrate - multilayer pcb manufacturing High Tg material VIPPO| YMSPCB – Yongmingsheng

Product Detail

What is A Multilayer PCB?

Multilayer PCB boards came into play with the intention of constructing more number of conductive layers on the board than single layer or double layer boards. Multi-layer boards come with a combination of single layer or double layer board and give opportunity to connect more electronic components in less space.

multilayer pcb multilayer pcb design buried and blind via High-TG pcb IST test stackup

YMS Multilayer PCB manufacturing capabilities:

YMS Multilayer PCB manufacturing capabilities overview
Feature	capabilities
Layer Count	3-60L
Available Multilayer PCB Technology	Through hole with Aspect Ratio 16:1
	buried and blind via
	Hybrid	High Frequency Material such as RO4350B and FR4 Mix etc.
		High Speed Material such as M7NE and FR4 Mix etc.
Thickness	0.3mm-8mm
Minimum line Width and Space	0.05mm/0.05mm(2mil/2mil)
BGA PITCH	0.35mm
Min mechanical Drilled Size	0.15mm(6mil)
Aspect Ratio for through hole	16:1
Surface Finish	HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc.
Via Fill Option	The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO)
	Copper filled, silver filled
Registration	±4mil
Solder Mask	Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.