HDI Multilayer PCB-China PCB Manufacturer | YMSPCB
HDI is short for high density interconnect, and refers to the use of buried, blind and micro vias as well as any layer HDIs to create compact multilayer boards. Besides the obvious benefit in packing the same board functionality into a smaller footprint, HDI comes with a number of benefits when compared to traditional multilayer designs:
Advantage
Fewer layers
Improved signal integrity
Lower power consumption
Better electrical performance
At the heart of these benefits is the fact that reducing signal path throughout your board will naturally improve signal integrity and electrical performance, provided that you are able to properly account for EMI/EMC considerations.
Let’s take a closer look at the features that make HDI possible:
Function
Microvias are extremely small vias (often laser drilled) with an aspect ratio (depth to diameter) of 1:1
Blind vias connect an exterior layer to at least one interior layer without penetrating the entire board.
Buried vias connect one or more inner layers together without any connections to the exterior layers of a board.
Any layer HDI (or ELIC) refers to the use of stacked copper-filled microvias to connect multiple layers in a PCB.
Lamination & Materials For HDI Boards
Advanced multilayer technology allows for designers to sequentially add additional pairs of layers to form a multilayer PCB. The use of a laser drill to produce holes in the internal layers allows for plating, imaging and etching prior to pressing. This added process is known as sequential build up. SBU fabrication uses solid filled vias allowing for better thermal management, a stronger inter connect and increasing the board’s reliability.
Resin coated copper was developed specifically to aide with poor hole quality, longer drill times and to allow for thinner PCBs. RCC has an ultra-low profile and ultra-thin copper foil that is anchored with minuscule nodules to the surface. This material is chemically treated and primed for the thinnest and finest line and spacing technology.
The application of dry resist to the laminate still uses heated roll method to apply the resist to core material. This older technology process, it is now recommended to preheat the material to a desired temperature prior to the lamination process for HDI printed circuit boards. The preheating of the material allows for better a steady application of the dry resist to the surface of the laminate, pulling less heat away from the hot rolls and allowing for consistent stable exit temperatures of the laminated product. Consistent entrance and exit temperatures lead to less air entrapment beneath the film; this is critical to the reproduction of fine lines and spacing.
Huizhou Yongmingsheng Technology co., ltd. is one of the leading HDI Multilayer PCB manufacturers, factories & suppliers in China, accepting OEM, ODM orders. We have rich experiences in production & research development for different PCB types. We focus on advanced technology, strict manufacturing step, and a perfect QC system.
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