Like glass fiber board, aluminum substrate is a common carrier of PCB. The difference is that the thermal conductivity of aluminum substrate is much higher than that of glass fiber board, so it is generally used in power components and other occasions prone to heat, such as LED lighting, switches and power drives.Here, the led aluminum pcb manufacturer tells you what is the difference between aluminum substrate and fiberglass.
Aluminum vs. Fiberglass Fiberglass is the most commonly used medium in circuit boards, such as the commonly used FR4 sheet.It is based on glass fiber as a substrate, after the copper surface is attached to the formation of copper clad plate, after a series of reprocessing to form a printed circuit board.
The copper foil of the glass fiber board is fixed with the glass fiber board through the binder, which is generally resin type.The fiberglass board itself is insulated and has some flame retardant properties, but its thermal conductivity is relatively poor.In order to solve the problem of thermal conductivity of glass fiber board, part of the components that have requirements for heat dissipation generally adopt the way of heat conduction through holes.And then through the auxiliary heat sink heat dissipation.
But for LED, it is not through direct contact with the heat sink for heat dissipation.If the hole is used for heat conduction, the effect is far from enough, so LED generally uses aluminum substrate as the circuit board material.
The structure of the aluminum substrate is basically similar to that of the fiberglass plate, except that the glass fiber is replaced with aluminum.Because aluminum itself is conductive, if the aluminum is directly coated with copper, it will cause a short circuit.So the binder in the aluminum substrate in addition to as a binding material, but also as the insulation material between copper and aluminum plate.The thickness of the binder will have a certain impact on the insulation of the plate, too thin insulation is not good, too thick will affect the heat conduction.
As can be seen from the structure of the aluminum substrate above, although the aluminum material is conductive, the insulation between the copper foil and aluminum material is carried out by resin.Therefore, the copper foil on the front is used as a conductive circuit, and the aluminum on the back is used as a heat conduction material, so it is not communicated with the copper foil on the front.
The aluminum is insulated from the copper foil by a resin, but it has a voltage range.In addition to the aluminum substrate, there is a higher thermal conductivity of copper substrate, this plate is generally used in power supply power components, its cost is much higher than the aluminum substrate.
The above is organized and published by LED aluminum substrate pcb suppliers. If you do not understand, please consult us at “ymspcb.com“.