Multilayer PCB manufacturing from 4 to 60 Layers | YMSPCB

Product Detail

The multilayer PCB refers to a printed circuit board with more than two layers, which is composed of interconnected lines on several layers of insulating substrates and pads for assembling and soldering electronic components. It has the function of conducting each layer of lines and insulating each other. High-speed PCBs are generally designed with multilayer PCB. Common multilayer boards are generally 4-layer boards or 6-layer boards, and complex multi-layer boardscan reach dozens of layers.

multilayer pcb multilayer pcb design buried and blind via High-TG pcb IST test stackup

YMS Multilayer PCB manufacturing capabilities:

YMS Multilayer PCB manufacturing capabilities overview
Feature	capabilities
Layer Count	3-60L
Available Multilayer PCB Technology	Through hole with Aspect Ratio 16:1
	buried and blind via
	Hybrid	High Frequency Material such as RO4350B and FR4 Mix etc.
		High Speed Material such as M7NE and FR4 Mix etc.
Thickness	0.3mm-8mm
Minimum line Width and Space	0.05mm/0.05mm(2mil/2mil)
BGA PITCH	0.35mm
Min mechanical Drilled Size	0.15mm(6mil)
Aspect Ratio for through hole	16:1
Surface Finish	HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc.
Via Fill Option	The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO)
	Copper filled, silver filled
Registration	±4mil
Solder Mask	Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.