Rapid Delivery for Printed Circuit Board Design - Aluminum pcbs led aluminum pcb 1Layer mirror Aluminum Base Board| YMSPCB – Yongmingsheng
What is Aluminum PCB?
An aluminum PCB has a similar layout to Normal PCB. It has a layer or layers of copper, solder mask and silkscreen layered over it. Instead of having a fiberglass or plastic substrate, though, an aluminum circuit board has a metal substrate. This base mainly contains a combination of aluminum. The metal core can consist entirely of metal or have a combination of fiberglass and aluminum. Aluminum PCBs typically are single sided, but can be double sided as well. Mulilayer Aluminum PCBs are highly difficult to manufacture.
Performance of Aluminum PCB
1. Thermal Dissipation
Common PCB substrates, such as FR4, CEM3 are poor conductors of thermal. If the heat of electronic equipments cannot be distributed in time, it will result in high temperature failure of electronic components. Aluminum substrates can solve this thermal dissipation problem.
2. Thermal Expansion
Aluminum substrate PCB can effectively solve the thermal dissipation problem, so that the thermal expansion and contraction problem of components on printed circuit boards with different substances can be alleviated, which improves the durability and reliability of whole machine and electronic equipments. In particular, aluminum substrate can solve the SMT (surface mount technology) thermal expansion and contraction problems.
3. Dimensional Stability
Aluminum substrate printed circuit board has apparently higher stability than the insulating material of the printed circuit board. When heated from 30 ° C to 140 ~ 150 ° C, the dimensional change of aluminum substrate is only 2.5 ~ 3.0%.
4. Other Performance
Aluminum substrate printed circuit board has shielding effect, and can alternative brittle ceramic substrate. Aluminum substrate also helps to improve the heat resistance and physical properties and reduce production costs and labor.
YMS Aluminum PCB manufacturing capabilities:
| YMS Aluminum PCB manufacturing capabilities overview | ||
| Feature | capabilities | |
| Layer Count | 1-4L | |
| Thermal Conductivity(w/m.k) | Aluminum PCB:0.8-10 | |
| Copper PCB:2.0-398 | ||
| Board Thickness | 0.4mm-5.0mm | |
| copper Thickness | 0.5-10OZ | |
| Minimum line Width and Space | 0.1mm/0.1mm(4mil/4mil) | |
| Speciality | Countersink,Counterbore drilling.etc. | |
| Types of Aluminum Substrates | 1000 series;5000 series;6000 series,3000 series.etc. | |
| Min mechanical Drilled Size | 0.2mm(8mil) | |
| Surface Finish | HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc. | |
| Solder Mask | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc. | |
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