Bendable PCB 1Layer camera module | YMSPCB

ITEM

Parameters

Base Materials

Polyimide or Polyester

Cover-lay

Polyimide, ,Polyester or Solder Mask

Thickness

0.5mil, 1mil, 2mil

Line Width/Space

Normal Min. 0.075/0.075mm, Special Min. 0.040/0.040mm

Conductor

1/3oz(12§)，0.5oz(18§), 1oz(35§), ED or RA Copper

Min. through hole diameter

Bit Drill Via Normal Min. ￥O 0.200mm, Special

Finish Plating

Electroless Nickel, Immersion Gold, Direct Gold, Soft Gold, Hard Gold, Organic Solderability Preservative, Immersion Tin

Stiffener

Stiffener PI, G/Epoxy, CEM3

Double Coated tape

Double Coated tape 3M 467,966, Sony D3430, T4100 ect