Popular Design for Bare Led Printed Circuit Board - Factory Supply China Immersion Gold Multilayer PCB Assembly, SMT PCB, PCB Manufacturer – Yongmingsheng
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What is high Tg PCB (printed circuit board)
Normally high Tg refers to high heat resistance in PCB raw material, the standard Tg for copper clad laminate is between 130 – 140℃, High Tg is generally greater than 170℃, and middle Tg is generally greater than 150℃. Basically the printed circuit board with Tg≥170℃, we call high Tg PCB.
Hard Gold
▪ Usual thickness: 0.7 µm (0.00003”) to 1.3 µm (0.00005”) gold (99.7%) over 5.0
▪ µm (0.0002”) nickel or 0.2 µm (0.000008”) to 0.3 µm (0.00001”) gold (99.7%) over
▪ 5.0 µm (0.0002”) nickel for a solderable surface
▪ Very good for corrosion resistance
▪ Rated at 130-220 Knoop hardness
▪ Very good wear resistance
▪ Excellent for surface rotary switches, on-off contacts, and edge connectors
▪ Very good shelf life
YMS High Tg PCB manufacturing capabilities:
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YMS High Tg PCB manufacturing capabilities overview |
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| Feature | capabilities | |
| Layer Count | 3-60L | |
| Available Multilayer PCB Technology | Through hole with Aspect Ratio 16:1 | |
| buried and blind via | ||
| Hybrid | High Frequency Material such as RO4350B and FR4 TG 180°Mix etc. | |
| High Speed Material such as M7NE and FR4 TG 180°Mix etc. | ||
| Thickness | 0.3mm-8mm | |
| Minimum line Width and Space | 0.05mm/0.05mm(2mil/2mil) | |
| BGA PITCH | 0.35mm | |
| Min mechanical Drilled Size | 0.15mm(6mil) | |
| Aspect Ratio for through hole | 16:1 | |
| Surface Finish | HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc. | |
| Via Fill Option | The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO) | |
| Copper filled, silver filled | ||
| Registration | ±4mil | |
| Solder Mask | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc. |
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